If your application requires a smaller, highly dependable packaged component, Micross provides a complete solution with our chip scale packaging. These packages deliver near-die sized footprints while also reducing overall thickness and weight.
A chip scale package brings together the performance and compactness of flip chip bare die with the durability of an encapsulated device—all in a miniature format. This makes chip scale packaging an excellent choice for battery-powered, small-form devices for a wide range of defense technologies.
Key Features:
- Flexible tooling for custom packages
- Single die design typically 20% larger than die size
- 0.5mm pitch up to 1.27mm pitch
- Capable of package heights <1mm
- MSL level 3 capable
