The Benefits of Micross Retail+

Retail+™ products are converted from RoHS Pb-free solder metallurgies to tin-lead (SnPb 63/37) based metallurgies. Pb-free BGA packages are reballed and Pb-free leaded and non-leaded packages go through a solder dip exchange using our established processes that brings them up to standards for use in hi-rel applications.

Electrical Verification

Micross performs the following electrical verification at 25°C on every device (100%):

• I_CC Static – Power is applied and all inputs pins/balls are configured in a known state. Overall current consumption is measured.
• Leakage – Power is applied and all inputs are configured in a known state. Current consumption on each pin/ball is measured.
• Continuity – This test is performed on each I/O pin/ball. V_DD and V_SS are all grounded. ~100uA of current is sinked and sourced across the protection diodes of every I/O pin/ball to test for opens and shorts.

Product Validation

Micross performs the following product validation on every device (100%):

• Visual Inspection – per MIL-STD-883, Test Method 2009
• Automatic Optical Inspection (AOI)
  • Ball Diameter & Ball Height
  • True Position (Ball Offset)
  • Array (Ball) Pitch
  • Ball Coplanarity

Micross performs the following additional product validation tests
on each product family:

• XRF
• Ball Shear
• X-Ray
• Ionograph
• SonoScan
• MSL

Options

• Temperature Range
  • C or CT or blank = Commercial (0°C to +70°C)
  • IT = Industrial (-40°C to +85°C)
  • ET = Enhanced (-40°C to +105°C)
  • AT = Automotive (-40°C to +125°C)
  • XT & M = Extended & Military (-55°C to +125°C)
• Markings
  • L = Label (default)
  • D = Orange Dot
  • A = Laser
• Special
  • ZZZ = Three-digit special flow requirement