The following is a press release from E2V announcing their CMOS AC/ACT logic product offering. All Tech Electronics is currently supporting this effort with inventory and backlog. Contact your All Tech representative for more information.
Milpitas, CA – Mar 3, 2016 – e2v inc today announced the addition of 14 new components to its advanced CMOS AC/ACT logic product offering. The expanded product line offers new standard AC/ACT logic functions processed to the MIL-PRF-38534 Class Q standard and the standard military temperature range of -55°C to +125°C.
These products are manufactured with new die and wafers that are designed and manufactured by e2v specifically for expanding the product portfolio supporting its military customers. e2v is a QML-qualified supplier with a commitment to the US Military to deliver ruggedized semiconductors in ceramic or plastic packages and can provide an additional source of supply for system design engineers in the aerospace, defense or other military markets.
Mont Taylor, vice-president of business development at e2v inc said, “This product offering demonstrates e2v’s capabilities in resurrections and obsolescence planning through our Semiconductor Lifecycle Management (SLiM™) program. We can help our customers lengthen the life of their existing systems by delivering critical components long after the original supplier has issued an end-of-life order. This is a subset of a logic family, but we can also resurrect analog functions.”
The AC/ACT product line provides basic-circuit building blocks used in subsystems from fighter planes and passenger jets to radar applications. The AC/ACT offering is supplied to DLA SMD standard microcircuit drawings and available to order as a catalog product.
e2v provides complete solutions with its Signal Chain Integrity Program (SCIP), which can guarantee supply and performance on products for 10+ years through qualification, inventory management, and product resurrections. This program can protect critical sockets across a program or platform by offering multi-project wafers to lower customer costs for families of parts.