Value Added Services

Component Solutions

To meet your component modification and testing needs, All Tech offers a suite of Value Added Services, ranging from:

• BGA Reballing: A process that flushes all lead-free balls and alloy residue from the pads and replaces them with Tin-Lead balls. RHSD equipment remove the balls and refinish the pads resulting in 100% pad alloy replacement ensuring the strongest solder joint. Our reballing process has undergone extensive qualification testing at independent labs proving that the process is safe and reliable. Parts can be processed per IEC TS62647-4.
• Robotic Hot Solder Dip (RHSD): Eliminates the risk of tin whiskers without damaging the component. From dip depth, dwell times, temperatures, continuous chemical monitoring and proprietary processes, no one in the industry comes close to the precise controls of the RHSD equipment. We’re able to service components efficiently, accurately and repeatability.
• Lead Attach: Proprietary process developed to maintain the integrity of component-to-PCB solder joints under stress. Poor compliance, extreme vibration and thermal expansion can cause these joints to crack. We use high-compliance leads that protect the solder interface by allowing the component to flex.
• CGA Attach: Guarantees a superior hi-reliability interconnect and best suited for assembly & component attached integrity. We provide a variety of Column Attach Services following identical processes, materials and workmanship standards as customers have been accustomed to historically from IBM.
• Trim/Form & Reconditioning: Choose from various shipment options with the ability to customize to specifications. We are equipped to trim and form component packages to your exact pre-assembly specifications. We also can modify tooling to meet any custom packaging requirements. You can choose from various shipment options – tray, tape-and-reel or trays customized to specifications. All components are baked and dry packed for moisture protection and when requested, can be sealed in nitrogen-filled bags to extend shelf life.

We also give you access to services such as die banking solutions, upscreening components and more. Our goal is to provide a comprehensive, complementary and competitive service for electronic manufacturing and component distribution.