Semiconductor technology moves so fast that many devices reach their end of life (EOL) within a few years due to Diminishing Manufacturing Sources (DMS) or Diminishing Manufacturing Sources and Material Shortages (DMSMS), either because demand is falling or they have been replaced by improved devices with additional features and specifications. However, the new devices often are not pin-to-pin, spec-to-spec replacements for the EOL legacy devices, which makes it difficult for OEMs to continue to build and support legacy military and space products that rely on the EOL device.

Based on our extensive experience with this all-too-common scenario, we’ve developed an in-depth understanding of how to manage semiconductor obsolescence and mitigate the risks associated with EOL devices. Our design engineers will consult with you to determine which of our services best meets your needs.

This includes:

Semiconductor Solutions

  • Replacement Parts for many Obsolete and End of Life Legacy Products
  • Replacement Parts for Legacy FPGAs
  • Form, Fit and Function Direct Replacement of FPGA with ASIC
  • “Trusted” Rad Hard solutions available

Electrical Testing and Up-Screening

  • Die and Wafer IP Banking and Vaulting
  • Product Packaging and Assembly
  • Die, Wafer and Package-Level Testing and Up-Screening
  • DPA
  • Counterfeit Mitigation
  • Custom Silicon ASIC/Hybrid Assembly and Testing

All Tech also gives you a reliable, quality alternative to in-house resources with:

  • Multiple focused resources available
  • EE Resource for technical support
  • Cross resource functionality
  • Multi level quote capabilities
  • Multi source solutions

Component Harvesting

An obsolete, long-lead time, or high-priced device mounted on an otherwise defective or obsolete circuit assembly can be removed, refinished, and verified for re-use by the original source, saving countless costs in redesign efforts or replacement.

Over 20 Years of Experience in Safely Harvesting Components for Board Repair & Re-Use

  • Fully automated process – No risk of bending or damaging leads.
  • Our harvesting process utilizes 17 rework/reflow stations
  • Heated Stage with forced, focused hot air
  • The most precise control of temperature ramp up, time at peak and ramp down
  • Eliminates potential of thermal damage to the harvested components and circuit board

Component Modification Services for Harvested Components

  • Robotic Hot Solder Dip (RHSD) and BGA reballing Using SAC305 for RoHS compatible or Sn63/Pb 37 for RoHS exempt applications
  • The most extensive array of next-gen equipment exceeding all process requirements of industry standards;
    • – GEIA-0006 (RHSD) and IEC TS62647-4 (Reballing) guaranteeing conformance to IPC-J-STD-001 & IPC-J-STD-002
  • Complete electrical, environmental & mechanical testing

No matter what your need, we’ll work with multiple resources and leverage their combined capabilities to deliver a completely finished solution.

We can also do a risk analysis for you – identifying which parts are high risk and making recommendations on how best to manage obsolescence, whether that’s developing new sources for parts or identifying replacement parts. Once we develop an obsolescence solution, we can design and manage that through our Material Management program

At All Tech, we only source from Original Component Manufacturer’s and we maintain control over the entire process. This helps us eliminate any risk that your design will be compromised by counterfeit parts. Choosing All Tech as a partner is also an effective way to develop new resources to complement the work done in-house with your own people.

All Tech Electronics

Obsolescence Management