Micross to provide access to Everspin MRAM in die form for those customers requiring small form factors
Micross Components (“Micross”), a global provider of specialty electronic components with a 35-year history in providing authentic, high-reliability products, announced an agreement with Everspin Technologies to distribute Everspin’s industry-leading MRAM products in die and wafer form.
MRAM has become the memory of choice in applications requiring intensive data logging, protection of data in the event of power loss and the ability to operate reliably at high speed over extreme temperatures. MRAM is a non-volatile memory that uses a magnetic state rather than electric charge to store data.
“For years, Micross has been providing its customers access to the leading edge of technology in die form and our partnership with Everspin and its MRAM technology extends our capability,” notes Tony Hamby, Micross’ Chief Commercial Officer. “Micross’ customers operate in the harshest of environments where data integrity and security are critical to mission success and Everspin’s MRAM technology greatly enhances their system reliability.”
“With this agreement our customers now have the ability to use our MRAM technology in die form with the support of industry leader Micross,” said Scott Sewell, Vice President of Sales and Marketing for Everspin.“ Many systems require unique packaging due to space constraints or harsh environments and now customers will be able to confidently design in MRAM.”
Everspin’s family of both parallel asynchronous IO and serial SPI interface products in densities ranging from 256Kb up to 16Mb are available now from Micross.