Bill of Materials Management
- Scrub and verify large BOMs quickly and accurately. Automatically identify and fix incorrect part numbers and manufacturer information.
- Identify High Risk Parts and flag high risk components to help you make better decisions.
- Proactively manage obsolescence with PCN alerts, years to end of life forecasts, part risk analysis & BOM Health checks.
- Instantly make your internal parts list searchable by uploading internal part numbers, inventory, pricing, and manufacturer preferences..
- Identify compromised components and actively fight counterfeit issues.
Long Term Die & Wafer Storage
Through our pratner, Micross we provide semiconductor die/wafer procurement & storage as well as large-capacity bare die banks, which can hold stock from a single diffusion run to assure homogeneity. Products are stored in a dedicated ESD-controlled environment in special smoke and water-resistant containers within a dry nitrogen environment that prevents contamination. The storage area is highly-secure and confined with bonded inventory control.
Die Banking Capabilities Include:
- Access to a product years after the LTB date
- Cost-effective extension of project life, eliminating the need for a redesign
- Environmentally safe storage that prevents deterioration
- Bare die products can be safely stored for many years
- We offer expertise in bare die and wafer handling
- We have a large storage capacity and can store die at multiple sites
- Store EOL Die for long-term sustainment – See EDSP
Wafers/Die Procurement & Storage Include:
- Micross procures or receives customer consigned inventory – specified semiconductor wafer or die materials using front end part number – delivers C of C to customer, and holds in long term storage to be shipped as required
- Front end/back end terms include predefined finished goods delivery schedule and disposition instructions for unused materials
Form-Fit-Function Recreation
- Die Characterization & Sourcing: Expertise in characterizing and reverse engineering devices, along with the broadest access to source functionally equivalent die.
- Product Recreation: Source functionally equivalent die to die & wafer processing to packaging & assembly to test & inspection to component modification. Interposers connect the I/O of the die to the device’s board-level interconnect, creating an exact drop-in-replacement for the existing board socket. The device is then tested to the defined requirements to ensure reliability and prepared for PCB assembly via component modification services.
- Up-Screening: Over 30 years experience up-screening and testing nearly all type of electronic components with a wide range of quality certifications.
- Space-Grade Up-Screening: Most complete turnkey solution for PEMs and COTS devices based on NASA instructions (PEM-INST-001) as well as any customer screening requirements.
- Mil-Grade Up-Screening: Keep critical platforms operational by up-screening COTS devices to industrial and military grade requirements when hi-rel Devices are unavailable.
Component Modification
- When you need one or more modifications on a device, All Tech can manage the entire process for you from beginning to end. Utilizing our Value Added resources, standard product that needs single or multiple modifications delivering a finished product from one source of supply. Standard product or custom packaged device are no problem for All Tech and their strategic business partners.
