Custom Packaging

With our Custom Packaging Services, you can get your parts exactly the way you want them without having to outsource to another provider.

There may be cases, for instance, where you want the functionality that a standard part offers, but it just doesn’t fit your application properly. Simply tell us what you need and our engineering team will design the part so that it fits your application. Here are some of our capabilites:

Hermetic Packaging: Ceramic & Metal Can

• Ceramic 600 & 400 mil DIP SOJ
• Two-sided LCC
• Four-sided LCC
• Gull Wing
• QFP
• PGA
• Flat Pack
• Formed-leaded Flat Pack
• Metal Can

CSP/Plastic Packaging

If your application or program demands a smaller, more reliable packaged component, All Tech can deliver a one source solution with our chip scale packaging. Chip scale packages offer near-die size footprints and reductions to package thickness and weight.

A chip scale package combines the performance and size advantages of flip chip bare die and the reliability of an encapsulated device in one tiny package. Chip scale packaging is the ideal solution for battery-powered small form factor devices such as industrial sensors and a variety of defense applications.

Key Features

• Flexible tooling for custom packages
• Single die design typically 20% larger than die size
• 0.5mm pitch up to 1.27mm pitch
• Capable of package heights <1mm
• MSL level 3 capable

Multi-Chip Modules

Flip Chip and Multi-Chip Module Assembly

We offer a wide array of flip chip assembly capabilities, from single chip placements to multi-chip module and system-in-package assembly of multiple die and components.

• Flip chip assembly for single and multi-chip applications
• Precision die placement with accuracies better than ± 0.5 microns
• Heterogeneous integration with Si, III-V and other device types/materials
• Plasma Assisted Dry Soldering (PADS) Process enables true fluxless for assembly for Sn-bearing solders

Metal-Metal Bonding for 2.5/3D Technologies

With our partner, Micross, All Tech offers access to a 2.5D/3D technology platform through joint development projects, prototyping services and small volume production. The 2.5D/3D integration technology platform is based on several enabling process modules, which include:

• Through-silicon via (TSV) interconnects
• High density 3D IC applications, filled 2-10 μm diameter, up to 8:1 aspect ratio and 10-50 μm pitch
• Lower density 2.5D/3D package architectures, 10-50 μm diameter, aspect ratio of 4:1 to 6:1 and 50-500 μm pitch; vias can be filled or barrel coated
• Wafer thinning (to < 20 μm Si thickness) and processing on temporary carrier wafer
• Flip-chip and high-density metal-metal bonding, down to <10 μm pitch
• Large-area multi-level metal routing with standard RDL (down to 10 μm L/S) or dual damascene process (down to 6 μm L/S)

Assembly Services

Providing full assembly services as well as the one source for all of your packaging needs.

Unlike many of our competitors, we have a comprehensive array of assembly capabilities. Our automated and state-of-the-art die attach, wire bond, encapsulation and CSP capabilities allow us to provide competitive solutions for a broad range of technologies. In addition, manufacturing sites are registered to the AS9100 Standard reinforcing our commitment to always providing the highest quality of products and services while continuing to meet the stringent needs of our aerospace, space, defense and medical customers.