Automated 6 axis robotic control In line with GEIA-STD-0006
An established process for bringing back BGA components to their original specification.
Component Modification -Leaded Components Realigned (Variety of Packages) ; Solderability Testing; Particle Impact Noise Detection (PIND); Fine and Gross Leak Testing; Lead Integrity Testing;Tensile Testing (Bond/Lead Pull); Tape and Reel
For More Information Contact:
All Tech Electronics, Inc.
105 Fairview Park Drive, Elmsford NY 10523
Tel: (914) 592-7726
FAX: (914) 592-8134